TSMC says it will start volume production of 1.6nm chips starting next year

TSMC says it will start volume production of 1.6nm chips starting next year

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The speed with which the best foundries are moving in their never-ending quest to improve the speed, performance and efficiency of smartphone chips is truly remarkable. Just this year, TSMC, the world's leading foundry, is set to begin mass production of 2nm chips. Next year, the Taiwanese company says it will begin mass production of 1.6nm chips. As these process node numbers decrease, the size of the transistors inside these chips shrinks, allowing more transistors to be installed inside them.

This is important because smaller transistors mean more of them can fit in a given area of ​​the chip. This metric, known as transistor density, usually rises when the process node goes down. The number of transistors in a chip is also important because the more transistors in a chip, the more powerful and power efficient these semiconductors are. Consider the staggering decline in process contracting that we have seen over the past few years.

For example, in 2019, the iPhone 11 series was powered by the 7nm A13 Bionic Application Processor (AP) carrying 8.5 billion transistors. Last September, The iPhone 16 Pro Max has been released with 3nm A18 Pro AP technology under the hood. Although Apple has never released the transistor count of the chipset, the component will likely contain more than 20 billion transistors considering that the A17 Pro has 19 billion transistors.

TSMC is starting to pull ahead as it just announced fourth-quarter revenue rose 37% year-over-year to $26.88 billion. What TSMC calls “smartphone seasonality” will lead to a sequential decline in its top line for the first quarter of 2025 even though the first-quarter total will be up year-over-year by 34.7%.

With the production of the 2nm wafer, TSMC will begin using gate all-in-one (GAA) transistors that use vertically stacked horizontal nanosheets allowing the gate to cover all four sides of the channel to prevent leakage current and optimize drive current. The result is higher-performance chips with greater power efficiency. When it starts producing 1.6nm chips, TSMC will start backlight power delivery (BPD). BPD moves the power delivery from the front of the silicon wafer, where it leaves less room for transistors, to the back, where it is not obstructed by other wires.

To illustrate how far we've come, the original iPhone, released in 2007, used a chip built on a 90nm process node. Coming The iPhone 17 series scheduled to launch next September will be powered by 3nm A19 and A19 Pro APs which will be manufactured using TSMC's third-generation 3nm (N3P) node. As a result, Apple should be able to introduce the first iPhone powered by a 2nm processor with the iPhone 18 series of 2026.

When will we see the first iPhone to feature an access point made using the 1.6nm node? We'll have to get back to you on that. Meanwhile, TSMC says the 1.6nm chips will provide an 8% to 10% speed improvement at the same power compared to a 2nm node.


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The speed with which the best foundries are moving in their never-ending quest to improve the speed, performance and efficiency of smartphone chips is truly remarkable. Just this year, TSMC, the world’s leading foundry, is set to begin mass production of 2nm chips. Next year, the Taiwanese company says it will begin mass production of 1.6nm chips. As these process node numbers decrease, the size of the transistors inside these chips shrinks, allowing more transistors to be installed inside them.

This is important because smaller transistors mean more of them can fit in a given area of ​​the chip. This metric, known as transistor density, usually rises when the process node goes down. The number of transistors in a chip is also important because the more transistors in a chip, the more powerful and power efficient these semiconductors are. Consider the staggering decline in process contracting that we have seen over the past few years.

For example, in 2019, the iPhone 11 series was powered by the 7nm A13 Bionic Application Processor (AP) carrying 8.5 billion transistors. Last September, The iPhone 16 Pro Max has been released with 3nm A18 Pro AP technology under the hood. Although Apple has never released the transistor count of the chipset, the component will likely contain more than 20 billion transistors considering that the A17 Pro has 19 billion transistors.

TSMC is starting to pull ahead as it just announced fourth-quarter revenue rose 37% year-over-year to $26.88 billion. What TSMC calls “smartphone seasonality” will lead to a sequential decline in its top line for the first quarter of 2025 even though the first-quarter total will be up year-over-year by 34.7%.

With the production of the 2nm wafer, TSMC will begin using gate all-in-one (GAA) transistors that use vertically stacked horizontal nanosheets allowing the gate to cover all four sides of the channel to prevent leakage current and optimize drive current. The result is higher-performance chips with greater power efficiency. When it starts producing 1.6nm chips, TSMC will start backlight power delivery (BPD). BPD moves the power delivery from the front of the silicon wafer, where it leaves less room for transistors, to the back, where it is not obstructed by other wires.

To illustrate how far we’ve come, the original iPhone, released in 2007, used a chip built on a 90nm process node. Coming The iPhone 17 series scheduled to launch next September will be powered by 3nm A19 and A19 Pro APs which will be manufactured using TSMC’s third-generation 3nm (N3P) node. As a result, Apple should be able to introduce the first iPhone powered by a 2nm processor with the iPhone 18 series of 2026.

When will we see the first iPhone to feature an access point made using the 1.6nm node? We’ll have to get back to you on that. Meanwhile, TSMC says the 1.6nm chips will provide an 8% to 10% speed improvement at the same power compared to a 2nm node.



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