MediaTek to rival Snapdragon with a new Dimensity 9400e
MediaTek to rival Snapdragon with a new Dimensity 9400e
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There are many great slices to choose from and soon, they will be added to the mediak's Dimensity 9400E.
Previously, he believed that these slides would reach the title of 9350 density, but a reliable leak The digital chat station claims to have a new name to closely with the Dimdenese 94xx family.
Photo source - Weibo
Slices (or chip systems) are an essential part of your smartphone. This is what the "brain" of the smartphone may call. This is where the majority of the components are integrated and includes the CPU (CPU), graphics processing unit (graphics processing unit), memory interfaces for memory, random access memory, communication units and more.
As the digital chat station also claims, the low density 9400E is mainly "a density -dependent upgrade". the Silicon 9300 DIM300 is installed in the X100 chain in Vivo, for example. It is powerful, because it pacates four cpu cpu prime cortex-X4 and four CPU Cortex-A720 Cortex-A720. The following is that there is no low -energy CPU. The low density 9400 (detected in the fall of 2024) operates the X200 series in VIVO. New 9400E's weak density should be considered a competitor to Snapdragon 8s Gen 4 (this component is also the Caliph L Snapdragon 8s Gen 3 from 2024).
To date, it is not clear which phones that will be operated by the low density of 9400E, but it will most likely be some strange devices from the Far East.
Although there is no official confirmation of GPU promotions, the 9400E density is expected to continue using GPU IMMORTALIS G720, which showed a strong performance in the 9300 series, especially with 46 % reinforced radiology traceable capabilities.
Artificial intelligence performance may also witness gradual improvements, through improvements in APU 790 MediaTek and improvements to Neuropilot. I have any zero expectations to any expectations about the 2025 SIM group that is not promoted as focusing on artificial intelligence. After all, this is the noise today!
Like its predecessors, the 9400E density can be manufactured on the TSMC 4NM operation knot. Although the specific details are still unknown, any developments in improving energy or thermal management can have a significant effect, especially for the slide designed to increase performance in all cores.
The low density of Mediaatek may be around the corner, although there is no accurate launch dates by Tipster.
There are many great slices to choose from and soon, they will be added to the mediak’s Dimensity 9400E.
Previously, he believed that these slides would reach the title of 9350 density, but a reliable leak The digital chat station claims to have a new name to closely with the Dimdenese 94xx family.
Photo source – Weibo
Slices (or chip systems) are an essential part of your smartphone. This is what the “brain” of the smartphone may call. This is where the majority of the components are integrated and includes the CPU (CPU), graphics processing unit (graphics processing unit), memory interfaces for memory, random access memory, communication units and more.
As the digital chat station also claims, the low density 9400E is mainly “a density -dependent upgrade”. the Silicon 9300 DIM300 is installed in the X100 chain in Vivo, for example. It is powerful, because it pacates four cpu cpu prime cortex-X4 and four CPU Cortex-A720 Cortex-A720. The following is that there is no low -energy CPU. The low density 9400 (detected in the fall of 2024) operates the X200 series in VIVO. New 9400E’s weak density should be considered a competitor to Snapdragon 8s Gen 4 (this component is also the Caliph L Snapdragon 8s Gen 3 from 2024).
To date, it is not clear which phones that will be operated by the low density of 9400E, but it will most likely be some strange devices from the Far East.
Although there is no official confirmation of GPU promotions, the 9400E density is expected to continue using GPU IMMORTALIS G720, which showed a strong performance in the 9300 series, especially with 46 % reinforced radiology traceable capabilities.
Artificial intelligence performance may also witness gradual improvements, through improvements in APU 790 MediaTek and improvements to Neuropilot. I have any zero expectations to any expectations about the 2025 SIM group that is not promoted as focusing on artificial intelligence. After all, this is the noise today!
Like its predecessors, the 9400E density can be manufactured on the TSMC 4NM operation knot. Although the specific details are still unknown, any developments in improving energy or thermal management can have a significant effect, especially for the slide designed to increase performance in all cores.
The low density of Mediaatek may be around the corner, although there is no accurate launch dates by Tipster.
